Once again, HKUST is reaping a harvest of academic honours. This time, two of its faculty members have been elected fellows of IEEE (Institute of Electrical and Electronics Engineers) and a third has been made a fellow of SID (Society for Information Display).

The only Russian faculty member at HKUST, Associate Professor in Electronic and Computer Engineering V G Chigrinov has been named an SID fellow.

Born and educated in Moscow, Prof Chigrinov joined HKUST in 1999 as an Associate Professor. He obtained his PhD degree in Solid State Physics (Liquid Crystals) in the Institute of Crystallography, the USSR Academy of Sciences and was subsequently appointed Chief of Department in Moscow's Organic Intermediates & Dyes Institute (NIOPIK). He was also a Leading Scientist in the Institute of Crystallography, Russian Academy of Sciences.

SID has a total of over 6000 members, all professionals in the technical and business disciplines that relate to display research, design, manufacturing, applications, marketing, and sales. Significantly, only six members in any given year are elected fellows, or 0.1% of the entire membership.

At the same time, Professor of Electronic and Computer Engineering Zexiang Li and Associate Professor of Mechanical Engineering Ricky Lee, have been elected fellows of IEEE.

IEEE Fellow status is granted to a person with an extraordinary record of accomplishments in any of the IEEE's designated fields of interest. This year, a total of four members from Hong Kong have been so honoured.

Prof Zexiang Li has been elected an IEEE Fellow for his contributions to robotic manipulation, nonholonomic motion planning and workpiece localization. Currently the director of HKUST's Automation Technology Center (ATC), Prof Li has worked with MIT and New York University after earning a PhD degree from the University of California at Berkeley.

Prof Ricky Lee received his PhD at Purdue University in 1992. He is currently Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He is awarded IEEE's fellowship for his contribution to "solder joint reliability and the development of three dimensional packaging technologies". Prof Lee is also an ASME (American Society of Mechanical Engineers) Fellow and IEEE CPMT Distinguished Lecturer.

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